The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2022
Filed:
Sep. 13, 2018
Applicant:
Infineon Technologies Austria Ag, Villach, AT;
Inventors:
Assignee:
Infineon Technologies Austria AG, Villach, AT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/28 (2006.01); H01L 23/29 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 23/532 (2006.01); H01L 23/495 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/293 (2013.01); H01L 21/56 (2013.01); H01L 23/53228 (2013.01); H01L 24/48 (2013.01); H01L 24/85 (2013.01); H01L 23/3107 (2013.01); H01L 23/49579 (2013.01); H01L 24/05 (2013.01); H01L 24/45 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/8592 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/181 (2013.01);
Abstract
A semiconductor device includes a semiconductor substrate and a metal structure in electrical contact with the semiconductor substrate. The metal structure has copper as a main component. An encapsulation layer includes a matrix material and a releasable copper corrosion inhibitor dispersed in the matrix material. The matrix material of the encapsulation layer at least partially covers the metal structure. A protective layer is at least partially on and in contact with a surface of the metal structure, and disposed between the metal structure and the encapsulation layer.