The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 22, 2022

Filed:

Jun. 26, 2020
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Seung-Nam Kim, Hwaseong-si, KR;

Sung-Keun Cho, Suwon-si, KR;

Seong Eon Park, Osan-si, KR;

Jung-Sub Shin, Seoul, KR;

Joon-Sung Lee, Hwaseong-si, KR;

Hyun Ik Joe, Hwaseong-si, KR;

Hyeon Cheol Jin, Hwaseong-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68742 (2013.01);
Abstract

A lift pin module includes a lift pin which includes a head portion disposed at a first end of the lift pin, and a connecting portion disposed at a second end of the lift pin opposite to the first end, the head portion connected to a stage disposed inside a semiconductor process chamber, and the head portion extending in a first direction; an upper weight which includes a side surface with an opening extending in the first direction, the opening configured to receive the lift pin therein, and the upper weight surrounding the connecting portion of the lift pin; and a lower weight screwed to the upper weight, the lower weight disposed below the upper weight.


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