The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2022
Filed:
Aug. 28, 2019
Applicant:
Kioxia Corporation, Tokyo, JP;
Inventors:
Katsuaki Natori, Yokkaichi Mie, JP;
Hiroshi Toyoda, Yokkaichi Mie, JP;
Masayuki Kitamura, Yokkaichi Mie, JP;
Takayuki Beppu, Yokkaichi Mie, JP;
Assignee:
KIOXIA CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/285 (2006.01); H01J 37/32 (2006.01); H01L 27/11582 (2017.01); H01L 21/673 (2006.01); C23C 16/455 (2006.01); C23C 16/06 (2006.01); C23C 16/44 (2006.01); C23C 16/458 (2006.01); H01L 21/28 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32862 (2013.01); C23C 16/06 (2013.01); C23C 16/4405 (2013.01); C23C 16/4584 (2013.01); C23C 16/45565 (2013.01); H01L 21/28568 (2013.01); H01L 21/6732 (2013.01); H01L 27/11582 (2013.01); H01L 29/40117 (2019.08); H01J 2237/3321 (2013.01);
Abstract
A method of manufacturing a semiconductor device includes placing a substrate in a housing, supplying first gas containing molybdenum to the housing to form a film that contains molybdenum, on the substrate, removing the substrate with the formed film from the hosing, and then supplying second gas containing chlorine to the housing to remove molybdenum deposited on a surface of the housing.