The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 22, 2022

Filed:

Jun. 25, 2018
Applicants:

Hefei Xinsheng Photoelectronics Technology Co., Ltd., Anhui, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Zhi Du, Beijing, CN;

Qicheng Chen, Beijing, CN;

Ming Zhang, Beijing, CN;

Haifeng Hu, Beijing, CN;

Liuyue Yin, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01); G06F 3/041 (2006.01); C23C 14/34 (2006.01); C23C 14/14 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0007 (2013.01); C23C 14/14 (2013.01); C23C 14/34 (2013.01); G06F 3/041 (2013.01); G06F 2203/04103 (2013.01);
Abstract

The present discloses is related to a method for manufacturing a touch substrate. The method of manufacturing the touch substrate may include depositing a first conductive film on a base substrate; performing a first joint exposure process based on a first negative photoresist on the base substrate on which the first conductive film was deposited to form a first electrode layer; forming an insulating layer on the base substrate on which the first electrode layer was formed; depositing a second conductive film on the base substrate on which the insulating layer was formed; and performing a second joint exposure process based on a second negative photoresist on the base substrate on which the second conductive film was deposited to form a second electrode layer.


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