The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 22, 2022

Filed:

Nov. 24, 2017
Applicant:

Shindengen Electric Manufacturing Co., Ltd., Tokyo, JP;

Inventors:

Kazuyuki Sashida, Hanno, JP;

Mizue Yamaji, Hanno, JP;

Kenichi Suzuki, Hanno, JP;

Kenichi Yoshida, Hanno, JP;

Shinji Kunori, Hanno, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 15/18 (2006.01); G01R 19/00 (2006.01); H01L 29/78 (2006.01); H01L 27/06 (2006.01);
U.S. Cl.
CPC ...
G01R 15/181 (2013.01); G01R 19/0092 (2013.01); H01L 29/7815 (2013.01); H01L 27/0629 (2013.01);
Abstract

A semiconductor device has a first electrodea second electrodeand a semiconductor layerhaving a winding wire partprovided so as to surround a current flowing between the first electrodeand the second electrodea winding return wire part, which is provided so as to surround the current, is connected to a terminal end part of the winding wire partand returns toward a starting end part side from the terminal end part, and an integration circuit configuration part connected to the winding wire partor the winding return wire part. The integration circuit configuration part has one or more of a resistance parta capacitor partand an operational amplifier part


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