The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 22, 2022

Filed:

Feb. 06, 2020
Applicant:

Ldc Precision Engineering Co., Ltd., New Taipei, TW;

Inventors:

Chi-Feng Hsu, New Taipei, TW;

Cheng-Jen Liang, New Taipei, TW;

Chih-Wei Chen, New Taipei, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); F28D 15/02 (2006.01); F28F 3/12 (2006.01); F28F 3/08 (2006.01); F28D 5/00 (2006.01); F28D 21/00 (2006.01);
U.S. Cl.
CPC ...
F28F 3/08 (2013.01); F28D 5/00 (2013.01); F28F 3/12 (2013.01); F28D 15/0266 (2013.01); F28D 2021/0029 (2013.01); F28D 2021/0064 (2013.01); H05K 7/20254 (2013.01); H05K 7/20309 (2013.01);
Abstract

A current stabilization and pressure boosting device for evaporator is disclosed, comprising a heat-sinking module and an outer case, wherein the heat-sinking module is assembled by successively stacking a large number of heat-sinking components, with each of the heat-sinking components having a first board surface, a second board surface and a third board surface, so that the insides of such heat-sinking components form a semi-open inner flow channel, and a fourth board surface is further respectively provided at the two ends of the heat-sinking components opposite to the inner flow channel, and the heat-sinking module is respectively configured with a water injection channel and an air exhausting channel, and the heat-sinking module is installed inside the outer case and the outer lid.


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