The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 22, 2022

Filed:

Mar. 19, 2020
Applicant:

Integran Technologies Inc., Mississauga, CA;

Inventors:

Gino Palumbo, Toronto, CA;

Leo Monaco, Toronto, CA;

Jonathan McCrea, Toronto, CA;

Klaus Tomantschger, Mississauga, CA;

Dave Limoges, Etobicoke, CA;

Michael Mills, Toronto, CA;

Assignee:

Integran Technologies Inc., Mississauga, CA;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 7/04 (2006.01); C25F 3/16 (2006.01); C25F 7/00 (2006.01); C25D 3/12 (2006.01); C25D 3/38 (2006.01);
U.S. Cl.
CPC ...
C25D 7/04 (2013.01); C25D 3/12 (2013.01); C25D 3/38 (2013.01); C25F 3/16 (2013.01); C25F 7/00 (2013.01);
Abstract

An apparatus and system for in-situ electropolishing and/or for in-situ electroforming a structural or functional reinforcement layer such as a sleeve of a selected metallic material on the internal surfaces of metallic tubular conduits are described. The apparatus and system can be employed on straight tubes, tube joints to different diameter tubes or face plates, tube elbows and other complex shapes encountered in piping systems. The apparatus includes components which can be independently manipulated and assembled on or near a degraded site and, after secured in place, form an electrolytic cell within the workpiece. The apparatus contains counter-electrodes which can be moved relative to the workpiece surface during the electroplating and/or electropolishing operation to provide flexibility in selecting and employing electropolishing process parameters and electroplating process parameters to design and optimize the surface roughness as well as the size, shape and properties of the electrodeposited reinforcing layer(s).


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