The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2022
Filed:
Dec. 20, 2019
Dalian University of Technology, Liaoning, CN;
Yiping Lu, Liaoning, CN;
Huanzhi Zhang, Liaoning, CN;
Tingju Li, Liaoning, CN;
Tongmin Wang, Liaoning, CN;
Zhiqiang Cao, Liaoning, CN;
Jinchuan Jie, Liaoning, CN;
Huijun Kang, Liaoning, CN;
Yubo Zhang, Liaoning, CN;
Zongning Chen, Liaoning, CN;
Enyu Guo, Liaoning, CN;
Dalian University of Technology, Dalian, CN;
Abstract
The present invention provides a radiation resistant high-entropy alloy and a preparation method thereof. A general formula of the radiation resistant high-entropy alloy is TiZrHfVMoTaNb, where 0.05≤x≤0.25, 0.05≤y≤0.5, and x and y are molar ratios. The preparation method of the radiation resistant high-entropy alloy comprises the following steps: mixing Ti, Zr, Hf, V, Mo, Ta, and Nb in order, and conducting vacuum levitation induction melting or vacuum arc melting, to obtain the radiation resistant high-entropy alloy. The high-entropy alloy in the present invention has an excellent irradiation resistance, and does not suffer radiation hardening damage under simulated helium ion irradiation. When helium bubbles are of same sizes as those of conventional alloy, the bubble density of the high-entropy alloy is far lower than that of the conventional alloy, and the lattice constant thereof decreases abnormally after irradiation.