The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 22, 2022

Filed:

Dec. 28, 2017
Applicant:

Daicel Corporation, Osaka, JP;

Inventor:

Yuichi Sakanishi, Tokyo, JP;

Assignee:

DAICEL CORPORATION, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C11D 7/32 (2006.01); C11D 11/00 (2006.01); C11D 1/72 (2006.01); C11D 3/30 (2006.01); C11D 3/39 (2006.01); C11D 17/08 (2006.01); H01L 21/02 (2006.01); H01L 21/304 (2006.01);
U.S. Cl.
CPC ...
C11D 11/0047 (2013.01); C11D 1/72 (2013.01); C11D 3/30 (2013.01); C11D 3/3942 (2013.01); C11D 17/08 (2013.01); H01L 21/02074 (2013.01); H01L 21/304 (2013.01);
Abstract

To provide a cleaning agent that can remove impurities such as metal polishing dust adhering to a semiconductor substrate without corroding metal and can prevent re-adhesion of the impurities. The semiconductor substrate cleaning agent of the present invention contains at least the following component (A) and component (B): Component (A): a water-soluble oligomer having a weight average molecular weight of not less than 100 and less than 10000; and Component (B): water. It is preferable that the water-soluble oligomer is at least one compound selected from compounds represented by the following formulas (a-1) to (a-3).RO—(CHO)—H  (a-1)RO—(RO)—H  (a-2)(R)—N—[(RO)—H]  (a-3)


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