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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11279861 B1

PDFFull Text
Date of Patent:
Mar. 22, 2022

Filed:

Feb. 20, 2018

Adhesive compositions based on grafted resins

Applicant:

Lord Corporation, Cary, NC (US);

Inventors:

Brian Carney, Erie, PA (US);

Douglas Mowrey, Titusville, PA (US);

Paul Wheeler, Erie, PA (US);

Rebecca Cowles, Wattsburg, PA (US);

Tarek Agag, Erie, PA (US);

Brian Perry, Concord Township, OH (US);

Andrew Heidenreich, Apex, NC (US);

Dodik Kurniawan, Nagoya, JP;

Jerry Phelps, Erie, PA (US);

Assignee:

LORD Corporation, Cary, NC (US);

Attorney:

Jenkins, Wilson, Taylor & Hunt, P.A.

Primary Examiner:

Christopher M Rodd

Int. Cl.
CPC ...
C09J 187/00 (2006.01); B29C 45/14 (2006.01); B32B 7/12 (2006.01); B32B 15/06 (2006.01); B32B 15/09 (2006.01); B32B 15/18 (2006.01); B32B 15/20 (2006.01); B32B 25/08 (2006.01); B32B 25/20 (2006.01); B32B 27/36 (2006.01); B32B 37/12 (2006.01); B32B 37/15 (2006.01); C09J 5/00 (2006.01); B29K 83/00 (2006.01); B29K 667/00 (2006.01);
U.S. Cl.
CPC ...
C09J 187/005 (2013.01); B29C 45/14311 (2013.01); B32B 7/12 (2013.01); B32B 15/06 (2013.01); B32B 15/09 (2013.01); B32B 15/18 (2013.01); B32B 15/20 (2013.01); B32B 25/08 (2013.01); B32B 25/20 (2013.01); B32B 27/36 (2013.01); B32B 27/365 (2013.01); B32B 37/1284 (2013.01); B32B 37/15 (2013.01); C09J 5/00 (2013.01); B29C 2045/14868 (2013.01); B29K 2083/005 (2013.01); B29K 2667/006 (2013.01); B32B 2250/02 (2013.01); B32B 2255/06 (2013.01); B32B 2255/10 (2013.01); B32B 2255/26 (2013.01); B32B 2274/00 (2013.01); B32B 2305/72 (2013.01); B32B 2311/24 (2013.01); B32B 2311/30 (2013.01); B32B 2319/00 (2013.01); B32B 2367/00 (2013.01); B32B 2383/00 (2013.01); C09J 2451/00 (2013.01); C09J 2479/02 (2013.01); C09J 2483/00 (2013.01);
Abstract

A curable adhesive that is particularly well suited for use in an injection or compression molding operation. The adhesive is based on polymeric resins having carboxylic acid and acrylate ester functionality, such as grafted phenoxy resin, and further constituents such as organic carbonates, blocked isocyanates, catalysts, maleimide compounds, hydride sources, and a carrier fluid. The curable adhesives are particularly well suited for bonding liquid injectable substrates such as liquid silicone rubber, or polyamides to rigid substrates, such as aluminum, stainless steel, or glass.

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