The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 22, 2022

Filed:

Jun. 17, 2019
Applicant:

Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;

Inventors:

Momoko Yamashita, Hiratsuka, JP;

Takafumi Oda, Hiratsuka, JP;

Hatsuki Oguro, Hiratsuka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 77/06 (2006.01);
U.S. Cl.
CPC ...
C08L 77/06 (2013.01); C08L 2205/025 (2013.01);
Abstract

There is provided a low-viscosity resin composition having high mechanical strength when formed into a molded article and having excellent fluidity, and a molded article formed from the resin composition. The resin composition includes a first polyamide resin and a second polyamide resin, the first polyamide resin being an amorphous polyamide resin in which 70 mol % or more of a structural unit derived from a diamine is a structural unit derived from isophorone diamine and a structural unit derived from dicarboxylic acid includes a structural unit derived from an α,ω-linear aliphatic dicarboxylic acid having from 8 to 14 carbon atoms and a structural unit derived from an aromatic dicarboxylic acid, the second polyamide resin being an amorphous polyamide resin in which at least one type of the structural unit is a structural unit including two or more alicyclic structures, and the mass ratio of the second polyamide resin to the sum of the first polyamide resin and the second polyamide resin being from 10 to 90% by mass.


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