The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2022
Filed:
Dec. 24, 2019
Applicant:
Skc Solmics Co., Ltd., Gyeonggi-do, KR;
Inventors:
Eun Sun Joeng, Ulsan, KR;
Hye Young Heo, Gyeonggi-do, KR;
Jang Won Seo, Busan, KR;
Jong Wook Yun, Gyeonggi-do, KR;
Assignee:
SKC solmics Co., Ltd., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/24 (2012.01); B24B 37/26 (2012.01); B24D 18/00 (2006.01); C08G 18/10 (2006.01); C08G 18/12 (2006.01); C08G 18/32 (2006.01); C08G 18/48 (2006.01); C08G 18/66 (2006.01); C08G 18/72 (2006.01); C08G 18/75 (2006.01); C08G 18/76 (2006.01); C08J 9/00 (2006.01); C08J 9/12 (2006.01); C08J 9/14 (2006.01); C08J 9/228 (2006.01); C08J 9/32 (2006.01); C08L 75/04 (2006.01); H01L 21/306 (2006.01); H01L 21/321 (2006.01);
U.S. Cl.
CPC ...
C08L 75/04 (2013.01); B24B 37/24 (2013.01); B24B 37/26 (2013.01); C08G 18/10 (2013.01); C08G 18/7621 (2013.01); H01L 21/3212 (2013.01);
Abstract
In the composition according to the embodiment, the composition of oligomers that constitute the chains in a urethane-based prepolymer may be adjusted to control the physical properties thereof such as gelation time. Thus, since the micropore characteristics, polishing rate, and pad cut rate of a polishing pad obtained by curing the composition according to the embodiment may be controlled, it is possible to efficiently manufacture high-quality semiconductor devices using the polishing pad.