The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 22, 2022

Filed:

Apr. 02, 2018
Applicant:

Mitsubishi Chemical Corporation, Tokyo, JP;

Inventors:

Osamu Okunaka, Tokyo, JP;

Hiroki Ishii, Tokyo, JP;

Kazuaki Itou, Tokyo, JP;

Shuuji Ishiwata, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 5/04 (2006.01); C08K 3/04 (2006.01); C08K 7/06 (2006.01); C08L 77/00 (2006.01); C08L 101/00 (2006.01); C08L 77/06 (2006.01);
U.S. Cl.
CPC ...
C08J 5/042 (2013.01); C08K 3/04 (2013.01); C08K 7/06 (2013.01); C08L 77/00 (2013.01); C08L 77/06 (2013.01); C08L 101/00 (2013.01); C08J 2300/22 (2013.01); C08J 2477/06 (2013.01); C08K 2201/004 (2013.01);
Abstract

Provided is a thermoplastic resin composition which provides a molded body having excellent thermal conductivity and excellent mechanical characteristics. A thermoplastic resin composition which contains (A) a thermoplastic resin, (B) pitch carbon fibers and (C) graphite, and wherein: the content of the graphite (C) is from 1% by mass to 20% by mass (inclusive) relative to 100% by mass of the thermoplastic resin composition; and a molded body, which is obtained by molding this thermoplastic resin composition and has a thickness of 1 mm, has a thermal conductivity of 10 W/mK or more as determined by a hot wire method.


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