The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 22, 2022

Filed:

Jul. 10, 2017
Applicant:

Hewlett-packard Development Company, L.p., Houston, TX (US);

Inventors:

Hector Lebron, San Diego, CA (US);

Jake Wright, San Diego, CA (US);

Morgan T. Schramm, Vanvcouver, WA (US);

Matthew A. Shepherd, Vancouver, WA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/393 (2017.01); B33Y 10/00 (2015.01); B33Y 50/02 (2015.01); B29C 64/153 (2017.01); B22F 10/00 (2021.01); B28B 1/00 (2006.01); B28B 17/00 (2006.01); B22F 10/10 (2021.01);
U.S. Cl.
CPC ...
B29C 64/393 (2017.08); B22F 10/00 (2021.01); B28B 1/001 (2013.01); B28B 17/0081 (2013.01); B29C 64/153 (2017.08); B33Y 10/00 (2014.12); B33Y 50/02 (2014.12); B22F 10/10 (2021.01);
Abstract

In an example, a method includes forming a layer of build material, processing a first portion of the build material by distributing a print agent using a first distribution pattern, the first distribution pattern having a first print agent dispersion characteristic and processing a second portion of the build material by distributing a print agent using a second distribution pattern, the second distribution pattern having a second print agent dispersion characteristic. The method may further include heating the build material by exposing the layer of build material to radiation so as to cause fusing of the first and second portion.


Find Patent Forward Citations

Loading…