The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 22, 2022

Filed:

Sep. 14, 2018
Applicant:

Mitsui High-tec, Inc., Kitakyushu, JP;

Inventors:

Hisatomo Ishimatsu, Kitakyushu, JP;

Shuhei Kotani, Kitakyushu, JP;

Hirotoshi Mabu, Kitakyushu, JP;

Tomoyoshi Ichimaru, Kitakyushu, JP;

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/76 (2006.01); G05B 19/12 (2006.01); H02K 15/12 (2006.01); G06K 19/06 (2006.01); B29C 45/14 (2006.01); H01F 41/02 (2006.01); B29C 45/02 (2006.01); H01F 41/00 (2006.01); H02K 15/10 (2006.01); H02K 15/03 (2006.01); H02K 1/276 (2022.01); H02K 1/28 (2006.01); H02K 11/35 (2016.01); B29L 31/00 (2006.01); B29K 705/12 (2006.01); H02K 1/27 (2022.01);
U.S. Cl.
CPC ...
B29C 45/766 (2013.01); B29C 45/02 (2013.01); B29C 45/14344 (2013.01); G06K 19/06028 (2013.01); G06K 19/06037 (2013.01); H01F 41/005 (2013.01); H01F 41/0233 (2013.01); H02K 15/10 (2013.01); H02K 15/12 (2013.01); B29C 45/14467 (2013.01); B29C 45/14639 (2013.01); B29C 45/14778 (2013.01); B29C 2045/1454 (2013.01); B29C 2045/14852 (2013.01); B29C 2045/14877 (2013.01); B29C 2045/14967 (2013.01); B29C 2945/76732 (2013.01); B29C 2945/76913 (2013.01); B29K 2705/12 (2013.01); B29K 2995/0008 (2013.01); B29L 2031/7498 (2013.01); G05B 19/128 (2013.01); H02K 1/27 (2013.01); H02K 1/276 (2013.01); H02K 1/28 (2013.01); H02K 11/35 (2016.01); H02K 15/03 (2013.01);
Abstract

The manufacturing method of a motor core includes attaching an ID code to a stack of blanked members in which a magnet insertion hole to fill with a resin material is formed, the ID code containing information in accordance with a type of the stack, reading the information from the ID code which is attached to the stack, and setting a mold condition based on the information read from the ID code. The mold condition includes at least one type of condition including: the resin material to be injected to the magnet insertion hole, an injection amount of the resin material, and a discharge position of the resin material. A mold device is controlled to inject the resin material to the magnet insertion hole in accordance with the mold condition.


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