The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 22, 2022

Filed:

Oct. 22, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Mark K. Hoffmeyer, Rochester, MN (US);

Timothy P. Younger, Rochester, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01); B23K 3/00 (2006.01); B23K 1/018 (2006.01); H05K 3/34 (2006.01); B23K 1/008 (2006.01); B23K 101/42 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
B23K 1/018 (2013.01); B23K 1/008 (2013.01); H05K 3/3436 (2013.01); H05K 3/3494 (2013.01); B23K 2101/42 (2018.08); H05K 1/181 (2013.01); H05K 2201/10189 (2013.01); H05K 2201/10719 (2013.01); H05K 2201/10734 (2013.01); H05K 2203/043 (2013.01); H05K 2203/176 (2013.01);
Abstract

Provided is a method for removing an electronic socket from a printed wiring board. The method comprises placing an embrittlement sheet over an electronic socket on a printed wiring board. The electronic socket is mounted to the printed wiring board using a plurality of hidden solder joints. The method further comprises causing the embrittlement sheet to melt. The melted embrittlement sheet wets the plurality of hidden solder joints. The electronic socket is removed from the printed wiring board by breaking the embrittled solder joints.


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