The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 15, 2022

Filed:

Dec. 30, 2020
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Shinichi Araki, Nagaokakyo, JP;

Kunihiro Komaki, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/28 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 3/282 (2013.01); H05K 1/118 (2013.01); H05K 1/0281 (2013.01); H05K 2201/099 (2013.01); H05K 2201/09236 (2013.01); H05K 2201/09381 (2013.01); H05K 2203/0594 (2013.01); H05K 2203/0597 (2013.01);
Abstract

A resin substrate includes a resin base material including a first main surface, electrode pads provided on the first main surface, circuit conductor patterns, a resist film, and a coverlay film. The resist film includes, on the outer circumference, a plurality of protruding portions each of which has a tapered shape with a vertex. A portion of the circuit conductor patterns are covered with the resist film, and the coverlay film covers a portion of the resist film including the protruding portions and exposed portions of the circuit conductor patterns. The protruding portions are located at positions sandwiching the exposed portions of the circuit conductor patterns.


Find Patent Forward Citations

Loading…