The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 15, 2022

Filed:

Jun. 19, 2018
Applicant:

Rigetti & Co, Llc, Berkeley, CA (US);

Inventors:

James Russell Renzas, San Mateo, CA (US);

Jayss Daniel Marshall, Fair Oaks, CA (US);

Cat-Vu Huu Bui, Fremont, CA (US);

Mehrnoosh Vahidpour, El Cerrito, CA (US);

William Austin O'Brien, IV, Sylmar, CA (US);

Andrew Joseph Bestwick, Berkeley, CA (US);

Chad Tyler Rigetti, Emeryville, CA (US);

Keith Matthew Jackson, Berkeley, CA (US);

Assignee:

Rigetti & Co, LLC, Berkeley, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/18 (2006.01); H01L 23/538 (2006.01); H05K 1/11 (2006.01); H01L 39/22 (2006.01); H01L 23/552 (2006.01); G06N 10/00 (2022.01);
U.S. Cl.
CPC ...
H01L 27/18 (2013.01); G06N 10/00 (2019.01); H01L 23/5383 (2013.01); H01L 23/552 (2013.01); H01L 39/223 (2013.01); H05K 1/115 (2013.01);
Abstract

In a general aspect, a superconducting via for routing electrical signals through a substrate includes the substrate and a layer formed of superconducting material. The substrate has a first orifice disposed on a first surface and a second orifice disposed on a second surface. A cavity extends through the substrate from the first orifice to the second orifice. The layer of superconducting material includes a first portion occluding the first orifice and having an exterior surface facing outward from the substrate. The layer also includes a second portion in contact with a side wall of the cavity and extending to the second orifice. A quantum circuit element may optionally be disposed on the first surface and electrically coupled to the exterior surface of the first portion of the layer.


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