The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2022
Filed:
May. 28, 2019
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Jong Yun Kim, Suwon-si, KR;
Chang Ju Lee, Suwon-si, KR;
Gye Won Lee, Suwon-si, KR;
Hee Sun Oh, Suwon-si, KR;
Hong Seok Lee, Suwon-si, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01); H05K 1/18 (2006.01); H01L 23/552 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5385 (2013.01); H01L 23/3128 (2013.01); H01L 23/367 (2013.01); H01L 23/5386 (2013.01); H01L 23/552 (2013.01); H05K 1/181 (2013.01); H05K 2201/10378 (2013.01);
Abstract
An electronic component module includes a first substrate mounted on an upper surface of a second substrate such that at least a portion of a lower surface of the first substrate is exposed externally of the second substrate and electronic devices mounted on the first substrate and the second substrate, including at least one electronic device mounted on the upper surface of the second substrate.