The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2022
Filed:
Sep. 18, 2020
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Yutaro Yamaguchi, Tokyo, JP;
Masatake Hangai, Tokyo, JP;
Shintaro Shinjo, Tokyo, JP;
Koji Yamanaka, Tokyo, JP;
Assignee:
MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/485 (2006.01); H01L 23/482 (2006.01); H01L 23/528 (2006.01); H01L 23/66 (2006.01);
U.S. Cl.
CPC ...
H01L 23/485 (2013.01); H01L 23/4821 (2013.01); H01L 23/5286 (2013.01); H01L 23/66 (2013.01); H01L 2223/6661 (2013.01);
Abstract
In a semiconductor device including gate fingers each having a linear shape extending from a feed line, and arranged in areas between drain electrodes and source electrodes, open stubs are connected directly to the feed line.