The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 15, 2022

Filed:

Jan. 30, 2018
Applicant:

Yasa Limited, Kidlington, GB;

Inventors:

Simon David Hart, Powys, GB;

Tim Woolmer, Waterperry, GB;

Christopher Stuart Malam, Powys, GB;

Tom Hillman, Oxford, GB;

Richard Phillips, Banbury, GB;

Assignee:

YASA LIMITED, Kidlington, GB;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/40 (2006.01); H01L 23/44 (2006.01); H01L 25/04 (2014.01); H01L 25/11 (2006.01); H01L 23/473 (2006.01); H02M 7/00 (2006.01); H02M 7/44 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H01L 23/367 (2013.01); H01L 23/40 (2013.01); H01L 23/44 (2013.01); H01L 25/04 (2013.01); H01L 25/115 (2013.01); H02M 7/003 (2013.01); H02M 7/44 (2013.01); H05K 7/2089 (2013.01);
Abstract

A semiconductor arrangement and an inverter incorporating the semiconductor arrangement, in particular to an inverter for use with traction power units e.g. for on and off road vehicles and stationary power inversion, are described. In the arrangement, semiconductor devices are thermally and electrically coupled to a heatsink as a module. The heatsink is configured as a bus bar to electrically connect the one or more semiconductor devices together to transmit power between the one or more semiconductor devices. The semiconductor devices may be cooled using the structure to which they are attached, and also immersed in a cooling medium to further increase the cooling of the device.


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