The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2022
Filed:
Nov. 28, 2018
Applicant:
Kyocera Corporation, Kyoto, JP;
Inventor:
Kenichi Kohama, Satsumasendai, JP;
Assignee:
KYOCERA CORPORATION, Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/13 (2006.01); H01L 23/473 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H01L 23/13 (2013.01); H01L 23/473 (2013.01); H01L 23/49822 (2013.01); H01L 24/48 (2013.01); H01L 27/14618 (2013.01); H01L 2224/48227 (2013.01);
Abstract
An electronic device is mountable on a substrate. The substrate includes a first layer and a second layer located on a lower surface of the first layer. The first layer includes a plurality of first through-cavities. The second layer includes at least one second through-cavity overlapping the plurality of first through-cavities in a plan view. The plurality of first through-cavities are continuous with the at least one second through-cavity.
Kohama, Kenichi. (2022). Electronic device mounting board, electronic package, and electronic module (U.S. Patent No. 11276617). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11276617
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile