The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2022
Filed:
Mar. 04, 2020
Applicant:
Fujitsu Limited, Kawasaki, JP;
Inventor:
Masaru Morita, Isehara, JP;
Assignee:
FUJITSU LIMITED, Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H01L 21/768 (2006.01); H05K 3/10 (2006.01); H05K 3/38 (2006.01); H05K 3/24 (2006.01); H05K 3/28 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76843 (2013.01); H01L 21/76852 (2013.01); H01L 21/76885 (2013.01); H05K 1/09 (2013.01); H05K 3/10 (2013.01); H05K 3/244 (2013.01); H05K 3/28 (2013.01); H05K 3/388 (2013.01); H01L 2221/1078 (2013.01); H05K 3/108 (2013.01); H05K 3/4661 (2013.01); H05K 2201/0338 (2013.01); H05K 2203/072 (2013.01);
Abstract
A wiring board includes a wiring layer; a diffusion suppressing layer that covers the wiring layer and suppresses diffusion of a metal component of the wiring layer; a base metal layer that covers the diffusion suppressing layer; and a passivation layer that covers the base metal layer.