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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11276600 B1

PDFFull Text
Date of Patent:
Mar. 15, 2022

Filed:

Mar. 14, 2017

Film for component manufacture and component manufacturing method

Applicant:

Mitsui Chemicals Tohcello, Inc., Tokyo, JP;

Inventor:

Eiji Hayashishita, Nagoya, JP;

Assignee:

MITSUI CHEMICALS TOHCELLO, INC., Tokyo, JP;

Attorney:

Buchanan Ingersoll & Rooney PC

Primary Examiner:

Scott W Dodds

Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 21/683 (2006.01); C09J 201/00 (2006.01); C09J 7/20 (2018.01); C09J 7/22 (2018.01); H01L 21/67 (2006.01); H01L 21/677 (2006.01); H01L 21/02 (2006.01); B32B 43/00 (2006.01); G01R 1/04 (2006.01); G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
H01L 21/683 (2013.01); C09J 7/20 (2018.01); C09J 7/22 (2018.01); C09J 201/00 (2013.01); H01L 21/67092 (2013.01); H01L 21/67098 (2013.01); H01L 21/67721 (2013.01); H01L 21/6836 (2013.01); B32B 43/006 (2013.01); C09J 2203/326 (2013.01); G01R 1/0491 (2013.01); G01R 31/2831 (2013.01); H01L 21/0201 (2013.01);
Abstract

Provided are a film for manufacturing semiconductor component, a film for electronic component manufacture, a method for manufacturing a semiconductor component using such a film for manufacturing semiconductor component, and a method for manufacturing an electronic component using such a film for electronic component manufacture. The film for component manufacture includes a base layer and an adhesive layer provided on one surface side of the base layer, and the Ra (μm) of the surface of one side of the base layer on which the adhesive layer is not provided is 0.1 to 2.0, and the Rz (μm) is 1.0 to 15. The method using the film for component manufacture includes a segmenting step, a pickup step, and an evaluation step prior to the pickup step.

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