The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 15, 2022

Filed:

Dec. 15, 2017
Applicant:

Amogreentech Co., Ltd., Gimpo-si, KR;

Inventors:

Min Ho Won, Incheon, KR;

Seung Jae Hwang, Incheon, KR;

Assignee:

AMOGREENTECH CO., LTD., Gimpo-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01H 45/04 (2006.01); H01H 45/12 (2006.01); B60R 16/02 (2006.01); H02G 5/06 (2006.01); H02B 1/46 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); B60R 16/023 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H01H 45/12 (2013.01); B60R 16/02 (2013.01); H01H 45/04 (2013.01); H02B 1/46 (2013.01); H02G 5/06 (2013.01); H05K 1/0207 (2013.01); H05K 1/0209 (2013.01); H05K 1/181 (2013.01); B60R 16/0238 (2013.01); B60Y 2200/91 (2013.01); H05K 1/0373 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/10053 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10181 (2013.01);
Abstract

A power relay assembly is provided. A power relay assembly according to an exemplary embodiment of the present invention comprises: an upper case having at least one electric element mounted on one surface thereof; a lower case coupled to the upper case; and at least one bus bar electrically connected to the electric element, disposed between the upper case and the lower case, and including a bottom portion that is in surface contact with at least one of the upper case and the lower case, wherein at least one side of the bottom portion contacts a portion made of a plastic material having heat dissipation and insulation properties in the upper case and the lower case.


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