The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 15, 2022

Filed:

Sep. 06, 2019
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventor:

Heung Kil Park, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/38 (2006.01); H01G 4/30 (2006.01); H01G 4/232 (2006.01); H01G 2/06 (2006.01); H01G 4/12 (2006.01); H01G 4/35 (2006.01);
U.S. Cl.
CPC ...
H01G 4/38 (2013.01); H01G 2/06 (2013.01); H01G 4/232 (2013.01); H01G 4/30 (2013.01); H01G 4/12 (2013.01); H01G 4/35 (2013.01);
Abstract

An electronic component includes a capacitor array in which a plurality of multilayer capacitors are disposed in a row in a first direction connecting fifth and sixth surfaces, each of the plurality of multilayer capacitors including a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes, and first and second external electrodes respectively including first and second connection portions and first and second band portions, respectively; a first bump terminal connected to the first band portions of the plurality of first external electrodes on a first surface of the capacitor array; and a second bump terminal spaced apart from the first bump terminal and connected to the second band portions of the plurality of second external electrodes on the first surface of the capacitor array.


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