The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 15, 2022

Filed:

Jan. 19, 2018
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventor:

Masahiro Totsuka, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/12 (2006.01); H01G 4/30 (2006.01); H01G 4/10 (2006.01); H01L 29/76 (2006.01); H01L 49/02 (2006.01); H01L 29/94 (2006.01);
U.S. Cl.
CPC ...
H01G 4/306 (2013.01); H01G 4/10 (2013.01); H01G 4/1272 (2013.01); H01L 28/40 (2013.01); H01L 29/76 (2013.01); H01L 29/94 (2013.01);
Abstract

An MIM capacitor or an MIS capacitor in semiconductor devices is formed of a thin dielectric layer having a total film thickness less than 100-nm and including a high-dielectric-constant amorphous insulating film, high-breakdown-voltage amorphous films such as of SiO, and high-dielectric-constant amorphous buffer films between an upper electrode and a lower electrode. The thin high-dielectric-constant amorphous insulation film is formed of a material having a property resistant to fracture although having properties of a large leakage current and a low breakdown voltage, to enhance reliability of the thin dielectric layer and to reduce the footprint thereof in the semiconductor device.


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