The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2022
Filed:
Nov. 26, 2018
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Woon Chui Choi, Suwon-Si, KR;
Ji Hye Oh, Suwon-Si, KR;
Hye Min Bang, Suwon-Si, KR;
Myung Jun Park, Suwon-Si, KR;
Jung Hyuk Jung, Suwon-Si, KR;
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 27/255 (2006.01); H01F 5/00 (2006.01); H01F 17/00 (2006.01); H01F 17/04 (2006.01); H01F 41/04 (2006.01); H01F 27/29 (2006.01);
U.S. Cl.
CPC ...
H01F 27/255 (2013.01); H01F 5/00 (2013.01); H01F 17/0013 (2013.01); H01F 17/04 (2013.01); H01F 27/28 (2013.01); H01F 41/043 (2013.01); H01F 41/046 (2013.01); H01F 27/292 (2013.01); H01F 2017/048 (2013.01);
Abstract
A multilayer seed pattern inductor includes: a magnetic body containing a magnetic material; and an internal coil part encapsulated in the magnetic body, wherein the internal coil part includes a seed pattern and a surface plating layer disposed on the seed pattern, the seed pattern being formed as two or more layers.