The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2022
Filed:
Feb. 26, 2019
Arizona Board of Regents on Behalf of the University of Arizona, Tucson, AZ (US);
Linan Jiang, Tucson, AZ (US);
Stanley K. H. Pau, Tucson, AZ (US);
Robert A. Norwood, Tucson, AZ (US);
ARIZONA BOARD OF REGENTS ON BEHALF OF THE UNIVERSITY OF ARIZONA, Tucson, AZ (US);
Abstract
A method of forming an optical interconnect between first and second photonic chips located on an optical printed circuit board includes applying a flexible, freestanding film onto the first and second chips so that the film extends over a gap and/or step between the chips. The film includes a photosensitive layer having a refractive index that decreases by exposure to radiation and a backing layer. The film is exposed to a flood exposure having a radiation dosage penetrating the backing layer and only a surface sublayer of the photosensitive layer. After curing the film, the backing layer is removed so that the photosensitive layer remains on the first and second chips. The photosensitive layer is selectively exposed to a second radiation dosage to define waveguide core(s) in unexposed regions of the photosensitive layer below the surface sublayer. The photosensitive layer is heated to cure the selectively exposed portions.