The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 15, 2022

Filed:

Feb. 04, 2019
Applicant:

Denso Corporation, Kariya, JP;

Inventors:

Takanori Kawashima, Anjo, JP;

Hitoshi Ozaki, Toyota, JP;

Assignee:

Denso Corporation, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01K 7/01 (2006.01); H01L 23/34 (2006.01); H01L 23/433 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
G01K 7/015 (2013.01); H01L 23/34 (2013.01); H01L 23/4334 (2013.01); H01L 23/49503 (2013.01); H01L 23/49541 (2013.01); H01L 23/49568 (2013.01); H01L 23/49575 (2013.01);
Abstract

A semiconductor device includes a first semiconductor element, a first signal terminal group, and a second signal terminal group disposed at an interval from the first signal terminal group. The first semiconductor element includes a control signal electrode to which a control signal for the first semiconductor element is input, and a temperature signal electrode that outputs a signal corresponding to temperature of the first semiconductor element. The temperature signal electrode is connected with a temperature signal terminal included in the first signal terminal group, and the control signal electrode is connected with a first control signal terminal included in the second signal terminal group.


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