The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 15, 2022

Filed:

Nov. 24, 2016
Applicant:

Koninklijke Philips N.v., Eindhoven, NL;

Inventors:

Thomas Erik Amthor, Eindhoven, NL;

Miha Fuderer, Eindhoven, NL;

Gerardus Bernardus Jozef Mulder, Eindhoven, NL;

Christoph Leussler, Eindhoven, NL;

Peter Forthmann, Eindhoven, NL;

Philippe Abel Menteur, Eindhoven, NL;

Assignee:

Koninklijke Philips N.V., Eindhoven, NL;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F25B 9/14 (2006.01); F25B 9/10 (2006.01); F25D 19/00 (2006.01); H01F 6/04 (2006.01);
U.S. Cl.
CPC ...
F25B 9/145 (2013.01); F25B 9/10 (2013.01); F25D 19/006 (2013.01); H01F 6/04 (2013.01);
Abstract

A cryogenic cooling system () comprising a cryostat (), a two-stage cryogenic cold head () and at least one thermal connection member () that is configured to provide at least a portion of a heat transfer path () from the second stage member () to the first stage member () of the two-stage cryogenic cold head (). The heat transfer path () is arranged outside the cold head (). A thermal resistance of the provided at least portion of the heat transfer path () at the second cryogenic temperature is larger than a thermal resistance of the provided at least portion of the heat transfer path () at the first cryogenic temperature.


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