The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2022
Filed:
May. 19, 2017
Applicant:
Rohm Co., Ltd., Kyoto, JP;
Inventor:
Hideki Sawada, Kyoto, JP;
Assignee:
ROHM CO., LTD., Kyoto, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2006.01); H05K 7/14 (2006.01); B60W 20/10 (2016.01); H05K 7/20 (2006.01); H01L 23/40 (2006.01); H01L 23/36 (2006.01); H01L 23/473 (2006.01); H01L 23/46 (2006.01);
U.S. Cl.
CPC ...
B60W 20/10 (2013.01); H01L 23/36 (2013.01); H01L 23/4006 (2013.01); H01L 23/46 (2013.01); H01L 23/473 (2013.01); H01L 25/16 (2013.01); H01L 25/162 (2013.01); H05K 7/1432 (2013.01); H05K 7/209 (2013.01); H05K 7/20927 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01);
Abstract
An intelligent power module includes: a heat radiation device; an attachment frame disposed on a mounting surface of the heat radiation device; a power semiconductor module mounted on the attachment frame and configured to seal a semiconductor device; and a drive circuit part mounted on the power semiconductor module via a heat insulating sheet and configured to drive the power semiconductor module.