The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 15, 2022

Filed:

Aug. 06, 2019
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Martin B. Wolk, Woodbury, MN (US);

Michael Benton Free, Baytown, MN (US);

Daniel J. Schmidt, Woodbury, MN (US);

Justin P. Meyer, Oakdale, MN (US);

Mark J. Pellerite, Woodbury, MN (US);

Stephen A. Johnson, Woodbury, MN (US);

Terry O. Collier, Woodbury, MN (US);

Xiaohua Ma, Woodbury, MN (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/18 (2006.01); B32B 38/00 (2006.01); H01G 4/30 (2006.01); B32B 37/00 (2006.01); B32B 38/10 (2006.01); H01L 51/00 (2006.01); B32B 7/025 (2019.01); B32B 7/06 (2019.01); B32B 17/06 (2006.01); B32B 3/26 (2006.01); H01M 4/04 (2006.01); H01M 6/40 (2006.01); B32B 27/08 (2006.01); H01M 6/00 (2006.01); H01M 10/02 (2006.01);
U.S. Cl.
CPC ...
B32B 38/0036 (2013.01); B32B 3/26 (2013.01); B32B 7/025 (2019.01); B32B 7/06 (2013.01); B32B 17/06 (2013.01); B32B 27/18 (2013.01); B32B 37/025 (2013.01); B32B 38/10 (2013.01); H01G 4/308 (2013.01); H01L 51/003 (2013.01); B32B 27/08 (2013.01); B32B 2307/302 (2013.01); B32B 2307/50 (2013.01); B32B 2457/00 (2013.01); B32B 2457/10 (2013.01); H01M 4/0471 (2013.01); H01M 6/005 (2013.01); H01M 6/40 (2013.01); H01M 10/02 (2013.01);
Abstract

Transfer films, articles made therewith, and methods of making and using transfer films to form an electrical stack are disclosed. The transfer films may include a plurality of co-extensive electrical protolayers forming an electrical protolayer stack, at least selected or each electrical protolayer independently comprising at least 25 wt % sacrificial material and a thermally stable material and having a uniform thickness of less than 25 micrometers. The transfer films may include a plurality of co-extensive electrical protolayers forming an electrical protolayer stack, at least selected or each protolayer independently exhibiting a complex viscosity of between 10and 10Poise at a shear rate of 100/s when heated to a temperature between its Tand T.


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