The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 15, 2022

Filed:

Dec. 11, 2019
Applicant:

The Clorox Company, Oakland, CA (US);

Inventors:

Nikhil P. Dani, Pleasanton, CA (US);

Joerg Hendrix, Kennesaw, GA (US);

Scott Wood, Pleasanton, CA (US);

Hubert Chan, Pleasanton, CA (US);

Mark Pszczolkowski, Pleasanton, CA (US);

Daniela Fritter, Pleasanton, CA (US);

Assignee:

The Clorox Company, Oakland, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 23/02 (2006.01); B32B 5/02 (2006.01); B32B 27/32 (2006.01); B32B 27/12 (2006.01); B08B 1/00 (2006.01); B32B 27/10 (2006.01); B32B 29/00 (2006.01); D21H 13/14 (2006.01); D21H 27/00 (2006.01); D21H 27/02 (2006.01); D21H 27/36 (2006.01); A47L 13/17 (2006.01); C11D 17/04 (2006.01); C11D 3/30 (2006.01); B32B 7/12 (2006.01); D21F 11/00 (2006.01); D21F 11/14 (2006.01);
U.S. Cl.
CPC ...
B32B 23/02 (2013.01); B08B 1/006 (2013.01); B32B 5/022 (2013.01); B32B 7/12 (2013.01); B32B 27/10 (2013.01); B32B 27/12 (2013.01); B32B 27/32 (2013.01); B32B 29/002 (2013.01); C11D 3/30 (2013.01); C11D 17/041 (2013.01); D21F 11/006 (2013.01); D21F 11/14 (2013.01); D21H 13/14 (2013.01); D21H 27/002 (2013.01); D21H 27/02 (2013.01); D21H 27/36 (2013.01); A47L 13/17 (2013.01); B32B 2250/03 (2013.01); B32B 2250/40 (2013.01); B32B 2260/04 (2013.01); B32B 2262/062 (2013.01); B32B 2274/00 (2013.01); B32B 2307/724 (2013.01); B32B 2307/728 (2013.01); B32B 2367/00 (2013.01); B32B 2432/00 (2013.01); Y10T 428/3188 (2015.04); Y10T 428/31855 (2015.04);
Abstract

Methods for forming multi-layer substrates including top and bottom surface layers and a melt softened thermoplastic material layer between the exterior surface layers, where the thermoplastic material includes polyethylene or has a tan delta value of 0.2 to 0.4 within the temperature range of 100° F.−350° F. The 3 (or more) layers are assembled, and heated, melt softening the thermoplastic material, causing bonding of the thermoplastic layer to the exterior surface layers. A cleaning composition may be loaded onto the multi-layer substrate, where a fluid pathway through the melted thermoplastic material allows the cleaning composition to travel between the surface layers. Adhesion between the surface layers and the thermoplastic layer is provided by the thermoplastic material itself, which bonds to groups of fibers in the surface layers. The process does not require chemical adhesives, any processing water, drying, or the like, so as to be possible with low capital investment.


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