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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11273619 B1

PDFFull Text
Date of Patent:
Mar. 15, 2022

Filed:

Mar. 27, 2020

Molded resin product

Applicants:

Honda Motor Co., Ltd., Tokyo, JP;

Continental Automotive Gmbh, Hannover, DE;

Sunarrow Ltd, Tokyo, JP;

Inventors:

Seonghun Lee, Wako, JP;

Ryo Gohara, Wako, JP;

YoungJin Hyun, Boon Keng Road, SG;

Takezo Takahata, Boon Keng Road, SG;

Hiroki Imai, Tokyo, JP;

Tomoomi Kiyomiya, Tokyo, JP;

Assignees:

HONDA MOTOR CO., LTD., Tokyo, JP;

Continental Automotive GmbH, Hannover, DE;

SUNARROW LTD, Tokyo, JP;

Attorney:

Amin, Turocy & Watson, LLP

Primary Examiner:

Jeffrey A Vonch

Int. Cl.
CPC ...
B32B 3/24 (2006.01); B32B 3/26 (2006.01); B32B 3/28 (2006.01); B32B 3/30 (2006.01); B32B 7/05 (2019.01); B32B 7/12 (2006.01); B32B 15/08 (2006.01); B32B 27/08 (2006.01); B32B 3/18 (2006.01); B32B 3/06 (2006.01); B32B 7/02 (2019.01); B32B 7/023 (2019.01); B32B 7/04 (2019.01); B32B 3/02 (2006.01); B29C 65/50 (2006.01); B29C 65/78 (2006.01); E05B 19/24 (2006.01); G07C 9/00 (2020.01); B32B 7/022 (2019.01); B32B 15/095 (2006.01); B32B 15/082 (2006.01); B32B 27/30 (2006.01); B32B 27/36 (2006.01); B32B 27/40 (2006.01); B32B 27/06 (2006.01); B32B 7/14 (2006.01); E05B 19/26 (2006.01);
U.S. Cl.
CPC ...
B32B 3/263 (2013.01); B32B 3/02 (2013.01); B32B 3/06 (2013.01); B32B 3/18 (2013.01); B32B 3/266 (2013.01); B32B 3/28 (2013.01); B32B 3/30 (2013.01); B32B 7/02 (2013.01); B32B 7/023 (2019.01); B32B 7/04 (2013.01); B32B 7/05 (2019.01); B32B 7/12 (2013.01); B32B 15/08 (2013.01); B32B 27/08 (2013.01); B29C 65/50 (2013.01); B29C 65/5064 (2013.01); B29C 65/7805 (2013.01); B29C 65/7814 (2013.01); B32B 7/022 (2019.01); B32B 7/14 (2013.01); B32B 15/082 (2013.01); B32B 15/095 (2013.01); B32B 27/06 (2013.01); B32B 27/304 (2013.01); B32B 27/36 (2013.01); B32B 27/40 (2013.01); B32B 2250/03 (2013.01); B32B 2250/04 (2013.01); B32B 2250/05 (2013.01); B32B 2250/44 (2013.01); B32B 2255/205 (2013.01); B32B 2255/26 (2013.01); B32B 2255/28 (2013.01); B32B 2307/20 (2013.01); B32B 2307/402 (2013.01); B32B 2307/4023 (2013.01); B32B 2307/41 (2013.01); B32B 2307/412 (2013.01); B32B 2307/50 (2013.01); B32B 2307/536 (2013.01); B32B 2307/546 (2013.01); B32B 2307/75 (2013.01); B32B 2451/00 (2013.01); E05B 19/24 (2013.01); E05B 19/26 (2013.01); G07C 9/00944 (2013.01); Y10T 428/24008 (2015.01); Y10T 428/24182 (2015.01); Y10T 428/24298 (2015.01); Y10T 428/24322 (2015.01); Y10T 428/24331 (2015.01); Y10T 428/24339 (2015.01); Y10T 428/24488 (2015.01); Y10T 428/24521 (2015.01); Y10T 428/24545 (2015.01); Y10T 428/24612 (2015.01); Y10T 428/24628 (2015.01); Y10T 428/24736 (2015.01); Y10T 428/24777 (2015.01); Y10T 428/24851 (2015.01); Y10T 428/24868 (2015.01); Y10T 428/28 (2015.01);
Abstract

A molded resin product includes a design layer including a decorative layer having a first color, a shielding layer having a second color different from the first color, and a resin base layer. A cover layer formed of a polymer film is disposed close to one end of the design layer. Part of the decorative layer exposed from the shielding layer serves as an exposed region. The exposed region and part of the shielding layer constitute a pattern portion presenting a predetermined figure or character when viewed in plan through the cover layer. The rest of the shielding layer constitutes a base portion. The layer thickness of the base portion is set smaller than the layer thickness of the pattern portion in a region thereof where the shielding layer is formed.

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