The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 08, 2022

Filed:

Feb. 22, 2019
Applicant:

Shenzhen Royole Technologies Co., Ltd., Guangdong, CN;

Inventors:

Zihong Liu, Guangdong, CN;

Xiaojun Yu, Guangdong, CN;

Peng Wei, Guangdong, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01); H05K 3/00 (2006.01); H01L 51/00 (2006.01); G02F 1/13 (2006.01); B32B 43/00 (2006.01); B32B 37/12 (2006.01); B32B 37/00 (2006.01); B32B 38/10 (2006.01); H01L 51/50 (2006.01);
U.S. Cl.
CPC ...
H05K 3/007 (2013.01); G02F 1/13 (2013.01); H01L 51/003 (2013.01); H01L 51/0097 (2013.01); B32B 37/0015 (2013.01); B32B 37/12 (2013.01); B32B 38/10 (2013.01); B32B 43/003 (2013.01); B32B 43/006 (2013.01); B32B 2457/00 (2013.01); H01L 51/50 (2013.01); H01L 2251/5338 (2013.01); H05K 2203/016 (2013.01);
Abstract

A method for fabricating a flexible electronic device, including the steps of: providing channels on a rigid substrate; adhering a flexible substrate to the rigid substrate with an adhesive; fabricating an electronic device on the flexible substrate; injecting a chemical substance into the channels; and reacting the chemical substance with the adhesive and peeling the flexible substrate from the rigid substrate. The rigid substrate comprises a first surface, a second surface opposite the first surface, and a side wall extending between the first surface and the second surface. The channels are provided on the first surface of the rigid substrate. The channels are in communication with an injection port, the injection port is located on the side wall of the rigid substrate, and a portion of the side wall is located between the injection port and the first surface.


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