The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2022
Filed:
Apr. 11, 2017
Applicant:
Analog Devices International Unlimited Company, Limerick, MA (US);
Inventors:
John David Brazzle, Tracy, CA (US);
Frederick E. Beville, San Jose, CA (US);
David A. Pruitt, San Jose, CA (US);
Assignee:
Analog Devices International Unlimited Company, Limerick, IE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 1/18 (2006.01); H01L 23/498 (2006.01); H01L 23/50 (2006.01); H05K 1/02 (2006.01); H05K 3/28 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H01L 23/49811 (2013.01); H01L 23/50 (2013.01); H05K 1/0203 (2013.01); H05K 3/284 (2013.01); H05K 3/3426 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10515 (2013.01); H05K 2201/10522 (2013.01); H05K 2201/10553 (2013.01); H05K 2201/10757 (2013.01); H05K 2203/1316 (2013.01);
Abstract
A component-on-package circuit may include a component for an electrical circuit and a circuit module attached to the component. The circuit module may have circuitry and at least one leadframe which connects the circuitry to the component both electrically and thermally. The leadframe may have a high degree of both electrical and thermal conductivity and a non-planar shape that provides spring-like cushioning of force applied to the component in the direction of the circuit module.