The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2022
Filed:
Jan. 16, 2019
Zkw Group Gmbh, Wieselburg, AT;
Dietmar Kieslinger, Theresienfeld, AT;
Erik Edlinger, Vienna, AT;
Markus Lahner, St. Pölten, AT;
Wolfgang Manhart, Sachsenkam, DE;
ZKW Group GmbH, Wieselburg, AT;
Abstract
The invention relates to an electronic module () comprising at least one printed circuit board of a first type (referred to as 'printed circuit board A'), which is equipped in an overlapping manner with at least one printed circuit board of a second type (referred to as 'printed circuit hoard B'), printed circuit board B being equipped with at least one electronic component with specific requirements (), and the interconnected printed circuit boards A and B forming a stepped composite printed circuit board (). The composite printed circuit board () is delimited at least in some regions by end regions () which are formed by sections of the at least one printed circuit board A, and the composite printed circuit board () is placed on a heat sink (). A fastening side () of the at least one printed circuit board B rests flat on a contact face () of the heat sink (), the contact face () of the heat sink () being dimensioned and positioned such that at least part of it extends laterally beyond the fastening side () of the at least one printed circuit board B in each case towards the end regions () formed. Supporting elements () are formed on the contact face () of the heat sink for the mechanical support of the end regions (). The invention also relates to a method for producing such an electronic module.