The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 08, 2022

Filed:

Nov. 07, 2019
Applicant:

Gigalane Co., Ltd., Hwaseong-si, KR;

Inventors:

Sang Pil Kim, Hwaseong-si, KR;

Byung Yeol Kim, Hwaseong-si, KR;

Ik Soo Kim, Hwaseong-si, KR;

Hee Seok Jung, Hwaseong-si, KR;

Assignee:

GIGALANE CO., LTD., Hwaseong-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0277 (2013.01); H05K 1/0213 (2013.01); H05K 3/4644 (2013.01); H05K 2201/0187 (2013.01); H05K 2201/10189 (2013.01);
Abstract

A flexible circuit board with improved bending reliability and a manufacturing method thereof are disclosed, the flexible circuit board comprising: a first dielectric formed to be elongated in a horizontal direction; a second dielectric positioned above the first dielectric; a third dielectric spaced apart from the second dielectric in the horizontal direction and positioned above the first dielectric; a first cover layer positioned on the first dielectric and covering an upper portion of the first dielectric between the second dielectric and the third dielectric; a first bonding sheet positioned between the first dielectric and the second dielectric and covering an upper portion of one end of the first cover layer; and a second bonding sheet positioned between the first dielectric and the third dielectric and covering an upper portion of the other end of the first cover layer.


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