The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 08, 2022

Filed:

Aug. 25, 2017
Applicant:

Taiyo Yuden Co., Ltd., Tokyo, JP;

Inventor:

Takashi Yamashita, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 41/313 (2013.01); H03H 9/25 (2006.01); H01L 41/047 (2006.01); H03H 9/05 (2006.01); H01L 41/053 (2006.01); H01L 41/187 (2006.01); H03H 3/08 (2006.01); H03H 9/64 (2006.01);
U.S. Cl.
CPC ...
H03H 9/059 (2013.01); H01L 41/0533 (2013.01); H01L 41/1873 (2013.01); H01L 41/313 (2013.01); H03H 3/08 (2013.01); H03H 9/25 (2013.01); H01L 41/047 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/15174 (2013.01); H03H 9/6483 (2013.01);
Abstract

An acoustic wave device includes: a mounting substrate; a first wiring layer located on an upper surface of the mounting substrate, the first wiring layer including a first bond region and a first connection region connecting with the first bond region and having a thickness substantially equal to a thickness of the first bond region; an element substrate mounted on the mounting substrate; an acoustic wave element located on a lower surface of the element substrate; and a second wiring layer located on the lower surface of the element substrate, the second wiring layer including a second bond region and a second connection region, the second bond region directly bonding with the first bond region of the first wiring layer, the second connection region connecting the acoustic wave element with the second bond region and having a thickness substantially equal to a thickness of the second bond region.


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