The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 08, 2022

Filed:

Oct. 24, 2019
Applicant:

Amphenol Corporation, Wallingford, CT (US);

Inventors:

Xingye Chen, Markham, CA;

Jason Si, Toronto, CA;

Assignee:

Amphenol Corporation, Wallingford, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/6587 (2011.01); H01R 12/58 (2011.01); H01R 12/72 (2011.01); H01R 12/73 (2011.01); H04B 10/40 (2013.01); H01R 13/6471 (2011.01); H05K 7/20 (2006.01); H01R 13/514 (2006.01);
U.S. Cl.
CPC ...
H01R 13/6587 (2013.01); H01R 12/585 (2013.01); H01R 12/724 (2013.01); H01R 12/737 (2013.01); H01R 13/514 (2013.01); H01R 13/6471 (2013.01); H04B 10/40 (2013.01); H05K 7/20154 (2013.01); H05K 7/20418 (2013.01);
Abstract

A high performance connector that provides heat dissipation sufficient to support operation of high power consuming QSFP-DD transceivers. The connector may be housed in a cage with a first channel to receive a transceiver. A connector port may be aligned with the first channel, and a heat transfer element comprising a compressible portion may make mechanical and thermal contact with a transceiver inside the first channel. The compressible portion may be urged to contact a transceiver by a biasing element. The heat transfer element may be thermally coupled to a heat dissipating element outside the cage. The cage may have multiple channels, and the heat transfer element may be installed in a channel between other channels, each receiving transceivers such that the heat transfer element may receive heat from multiple transceivers.


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