The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 08, 2022

Filed:

Oct. 20, 2020
Applicant:

Nichia Corporation, Anan, JP;

Inventors:

Yasuo Fujikawa, Yokohama, JP;

Takuya Wasa, Kaifu-gun, JP;

Yosuke Nakayama, Komatsushima, JP;

Assignee:

NICHIA CORPORATION, Anan, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/62 (2010.01); H05K 1/14 (2006.01); H01L 27/15 (2006.01); F21K 9/00 (2016.01); H01L 25/075 (2006.01); H05K 3/36 (2006.01); F21Y 101/00 (2016.01); F21Y 107/70 (2016.01); F21Y 105/16 (2016.01); F21Y 103/10 (2016.01); F21Y 115/10 (2016.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); F21K 9/00 (2013.01); H01L 25/0753 (2013.01); H01L 27/156 (2013.01); H05K 1/141 (2013.01); H05K 3/363 (2013.01); F21Y 2101/00 (2013.01); F21Y 2103/10 (2016.08); F21Y 2105/16 (2016.08); F21Y 2107/70 (2016.08); F21Y 2115/10 (2016.08); H05K 1/118 (2013.01); H05K 2201/09172 (2013.01); H05K 2201/09781 (2013.01); H05K 2201/10106 (2013.01);
Abstract

A light emitting device includes: a substrate including: a flexible base member, a first wiring pattern located on the upper surface of the base member, the first wiring pattern including: a first component-side conductive portion, and a second component-side conductive portion, and a plurality of reinforcing lands located on the upper surface of the base member, the plurality of reinforcing lands including: a first reinforcing land, and a second reinforcing land; and a plurality of light emitting elements mounted on the substrate, each light emitting element being electrically connected to the first component-side conductive portion and the second component-side conductive portion.


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