The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2022
Filed:
Aug. 20, 2020
Applicant:
Analog Devices, Inc., Norwood, MA (US);
Inventors:
Ahmadreza Odabaee, Milpitas, CA (US);
John David Brazzle, Tracy, CA (US);
Zafer Kutlu, Menlo Park, CA (US);
Zhengyang Liu, Pleasanton, CA (US);
George Anthony Serpa, San Jose, CA (US);
Assignee:
Analog Devices, Inc., Norwood, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2006.01); H01F 27/28 (2006.01); H02M 3/04 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/16 (2013.01); H01F 27/2804 (2013.01); H01L 24/16 (2013.01); H02M 3/04 (2013.01); H01L 2224/16265 (2013.01); H01L 2924/1427 (2013.01); H01L 2924/19042 (2013.01);
Abstract
This disclosure describes techniques to provide a regulator circuit using a component-on-top (CoP) package. The CoP package comprising a system-in-package (SIP) comprising regulator circuitry, the SIP having a top portion and a first side portion; and an inductor on the top portion of the SIP, wherein: the inductor is coupled to the regulator circuitry via the top portion of the SIP; and a first end of the inductor extends beyond the first side portion of the SIP.