The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 08, 2022

Filed:

May. 30, 2019
Applicant:

National Institute of Advanced Industrial Science and Technology, Tokyo, JP;

Inventors:

Masaru Hashino, Tsukuba, JP;

Ying Ying Lim, Tsukuba, JP;

Hiroshi Nakagawa, Tsukuba, JP;

Masahiro Aoyagi, Tsukuba, JP;

Katsuya Kikuchi, Tsukuba, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/13 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/17 (2013.01); H01L 23/13 (2013.01); H01L 24/06 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/14 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 24/05 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/06102 (2013.01); H01L 2224/1145 (2013.01); H01L 2224/11472 (2013.01); H01L 2224/13018 (2013.01); H01L 2224/141 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/16014 (2013.01); H01L 2224/16057 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/1703 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81203 (2013.01); H01L 2924/10157 (2013.01); H01L 2924/15159 (2013.01);
Abstract

The purpose of the present invention is to provide an electronic circuit connection method and an electronic circuit capable of improving the reliability of electrical connection. A connection method for an electronic circuitincludes: a process of forming a first metal bumpsand a second metal bump, each of which has a cone shape; and a process of joining a first electrode padand a third electrode padby the first metal bumpand joining a second electrode padand a fourth electrode padby the second metal bump, wherein at least one region of between a first regionand a second regionin a first connection surfaceand between a third regionand a fourth regionin a second connection surfacehas a step, and the first metal bumpand the second metal bumphave different heights so as to correct a height Hof the step


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