The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 08, 2022

Filed:

May. 13, 2020
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Doo Il Kim, Suwon-si, KR;

Bang Chul Ko, Suwon-si, KR;

Sung Youl Choi, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 23/538 (2006.01); H01L 27/32 (2006.01); H01L 25/065 (2006.01); H01L 25/04 (2014.01); H01L 25/07 (2006.01); H01L 25/11 (2006.01); H01L 25/16 (2006.01); H01L 51/00 (2006.01); H01L 51/52 (2006.01); H01L 23/00 (2006.01); H01P 5/04 (2006.01); H01Q 9/04 (2006.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H01L 23/5387 (2013.01); H01L 24/16 (2013.01); H01L 27/323 (2013.01); H01L 27/3276 (2013.01); H01L 51/0097 (2013.01); H01L 51/5237 (2013.01); H01P 5/04 (2013.01); H01Q 9/0407 (2013.01); H01L 25/042 (2013.01); H01L 25/0655 (2013.01); H01L 25/072 (2013.01); H01L 25/0753 (2013.01); H01L 25/115 (2013.01); H01L 25/162 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16225 (2013.01); H01L 2251/5338 (2013.01);
Abstract

A radio-frequency module includes a radio-frequency integrated circuit (RFIC) including a base connection terminal, and a first radio-frequency (RF) connection terminal; a first connection member including a mounting area on which the RFIC is mounted, a base wiring electrically connected to the base connection terminal of the RFIC, and a first RF wiring electrically connected to the first RF connection terminal of the RFIC; a second connection member including a second RF wiring electrically connected to the first RF wiring of the first connection member, and a third RF wiring, at least a portion of the second connection member being more flexible than the first connection member; and a front-end integrated circuit (FEIC) mounted on the second connection member and configured to amplify the first RF signal to generate the first communications signal or amplify the first communications signal to generate the first RF signal.


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