The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 08, 2022

Filed:

Dec. 13, 2018
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Rui Tang, San Diego, CA (US);

Zhongning Liu, San Diego, CA (US);

Chenqian Gan, Shanghai, CN;

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/64 (2006.01); H01L 49/02 (2006.01); H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 23/645 (2013.01); H01L 28/10 (2013.01); H05K 9/0064 (2013.01); H05K 9/0081 (2013.01);
Abstract

A substrate that includes at least one dielectric layer, a first inductor formed in the at least one dielectric layer, a second inductor formed in the at least one dielectric layer, and a patterned ground layer formed on a metal layer of the substrate. The patterned ground layer is configured to provide electromagnetic (EM) shielding. The patterned ground layer includes a plurality of slots. The plurality of slots may be filled with the at least one dielectric layer. The plurality of slots may include a slot with a rectangular shape, a slot with a polygon shape, a slot with a circular shape, or combinations thereof. The patterned ground layer may include at least one slot that, individually or collectively, has a shape of a spiral.


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