The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2022
Filed:
May. 04, 2020
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Paul Merle Emerson, Madison, AL (US);
Benjamin Stassen Cook, Los Gatos, CA (US);
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/525 (2006.01); H01L 49/02 (2006.01); H01L 21/66 (2006.01); H01L 21/288 (2006.01); H01L 23/64 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5256 (2013.01); H01L 21/288 (2013.01); H01L 21/78 (2013.01); H01L 22/14 (2013.01); H01L 23/647 (2013.01); H01L 28/20 (2013.01);
Abstract
A first conductive routing structure is electrically connected to a first electronic component. A second conductive routing structure is electrically connected to a second electronic component. An additive deposition process deposits a material over a surface of a processed wafer to form a conductive or resistive structure, which extends from a portion of the first conductive routing structure to a portion of the second conductive routing structure, to configure a circuit including the first and second electronic components.