The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2022
Filed:
Dec. 26, 2018
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Dongbin Hou, Plano, TX (US);
Steven Alfred Kummerl, Carrollton, TX (US);
Roberto Giampiero Massolini, Pavia, IT;
Joyce Marie Mullenix, San Jose, CA (US);
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 23/00 (2006.01); H01L 23/495 (2006.01); H01L 23/29 (2006.01); H01L 21/56 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5227 (2013.01); H01L 21/565 (2013.01); H01L 23/29 (2013.01); H01L 23/4952 (2013.01); H01L 23/49534 (2013.01); H01L 24/09 (2013.01); H01L 28/10 (2013.01);
Abstract
An integrated circuit (IC) package comprises a semiconductor die, a leadframe comprising a plurality of leads coupled to bond pads on the semiconductor die, and an electrically conductive member electrically coupled to the leadframe. A magnetic mold compound encapsulates the electrically conductive member to form an inductor. A non-magnetic mold compound encapsulates the semiconductor die, the leadframe, and the magnetic mold compound.