The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2022
Filed:
Aug. 21, 2017
Jfe Precision Corporation, Niigata, JP;
Hoshiaki Terao, Niigata, JP;
Kouichi Hashimoto, Niigata, JP;
JFE PRECISION CORPORATION, Niigata, JP;
Abstract
Provided is a heat sink that has a clad structure of a Cu—Mo composite material and a Cu material and has a low coefficient of thermal expansion and high thermal conductivity. The heat sink comprises a pair of Cu—Mo composite layers and a Cu layer stacked in a thickness direction so that the Cu layer is interposed between the Cu—Mo composite layers or comprises three or more Cu—Mo composite layers and two or more Cu layers alternately stacked in the thickness direction so that two of the Cu—Mo composite layers are outermost layers on both sides, wherein each of the Cu—Mo composite layers has a thickness section microstructure in which flat Mo phase is dispersed in a Cu matrix. Such a clad structure achieves high thermal conductivity together with a low coefficient of thermal expansion.