The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 08, 2022

Filed:

Aug. 27, 2020
Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventors:

Tadashi Nomura, Kyoto, JP;

Takafumi Kusuyama, Kyoto, JP;

Yoshitaka Echikawa, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01); H01L 23/552 (2006.01); H01L 25/065 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3185 (2013.01); H01L 21/56 (2013.01); H01L 23/49811 (2013.01); H01L 23/552 (2013.01); H01L 25/0652 (2013.01); H01L 25/165 (2013.01); H01L 21/561 (2013.01);
Abstract

A radio-frequency moduleincludes a wiring board, a first componentmounted on a lower surfaceof the wiring board, a plurality of connection terminals, a first sealing resin layerthat covers the first componentand the connection terminals, a plurality of second componentsmounted on an upper surfaceof the wiring board, a second sealing resin layerthat covers the second components, and a shield film. By adjusting surface roughness of a lower surfaceof the first sealing resin layer, surface roughness of a lower surfaceof the first component, and surface roughness of a lower surfaceof the connection terminal, it is possible to prevent abnormal deposition of plating and a crack in the first component, and to prevent malfunction of the radio-frequency module


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